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Reductive deposition of Au3+(aq) on oxidized silicon surfaces

机译:在氧化的硅表面上还原沉积Au3 +(aq)

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摘要

X-ray photoelectron spectroscopy (XPS) is used to determine the oxidation state of gold deposited from an aqueous solution of AuCl4- on to various oxidized surfaces of silicon. Although the observed Au4f signal decreased with the thickness of the oxide layer, the oxidation state of Au was determined as 0 for all the samples analyzed. From the angular dependence of the Si2p and Au4f signals it was determined that Au is deposited on top of the oxidized surfaces of metallic silicon. It is postulated that from an aqueous solution of AuCl4-, gold would deposit in its zerovalent form on to any surface due to its large and positive electrochemical reduction potential (ε° (red) (Au3+/Au) = +1.50 V) and the substrate plays a role only in providing active deposition sites. To further support the proposal, it is shown that the same process takes place even in inert and hydrophobic polypropylene substrates. Similarly, it is also shown that more gold deposits if the surface of the polypropylene is made less hydrophobic (but probably more active) via the industrially used corona discharge treatment.
机译:X射线光电子能谱(XPS)用于确定从AuCl4-水溶液沉积到硅的各种氧化表面上的金的氧化态。尽管观察到的Au4f信号随氧化物层的厚度而降低,但对于所有分析的样品,Au的氧化态均确定为0。根据Si2p和Au4f信号的角度依赖性,可以确定Au沉积在金属硅的氧化表面上。据推测,由于其大而正的电化学还原电势(ε°(红色)(Au3 + / Au)= +1.50 V)和正电,AuCl4-水溶液中的金将以零价形式沉积在任何表面上。基底仅在提供活性沉积位点中起作用。为了进一步支持该提议,表明即使在惰性和疏水性聚丙烯基材中也进行相同的过程。类似地,还表明,如果通过工业上使用的电晕放电处理使聚丙烯的表面疏水性降低(但可能更具活性),则会沉积更多的金。

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  • 作者

    Süzer, S.; Dag O.;

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  • 年度 2000
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  • 原文格式 PDF
  • 正文语种 English
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